Multibeam resolution die-to-database reticle inspection

William Waters Volk; William H. Broadbent; Hector I. Garcia; Sterling G. Watson; Phillip Lim; Wayne E. Ruch

doi:10.1117/12.479351

16 August 2002 Multibeam resolution die-to-database reticle inspection

William Waters Volk, William H. Broadbent, Hector I. Garcia, Sterling G. Watson, Phillip Lim, Wayne E. Ruch

Proceedings Volume 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents; (2002) https://doi.org/10.1117/12.479351
Event: 18th European Mask Conference on Mask Technology for Integrated Circuits and Micro-Components, 2002, Munich-Unterhaching, Germany

Abstract

A new die-to-database reticle inspection system has been developed to meet the production requirements for 130nm node 4x reticles, as well as, the early inspection requirements for 100nm node 4x reticles. This new system is based on the TeraStar platform¹ developed recently by KLA-Tencor Corporation for high performance die-to-die and STARlight inspection of 130nm node reticles. The TeraStar platform uses high-NA triple-beam scanning laser optics for high throughput. The platform also includes a new generation of defect detection algorithms and image processing hardware to inspect, with high sensitivity and low false detections, the small linewidths, aggressive OPC, and advanced EPSM 4x reticles characteristic of the 130nm node. The platform further includes the TeraPro concurrent STARlight and die- to-die inspection mode for exceptional productivity. The necessary database elements have now been developed and added to the TeraStar platform, to give it die-to-database inspection capability. A new data format along with new data preparation, data rendering, and data modeling algorithms have been developed to allow high precision database matching with the optical image for exceptional die-to- database performance. The TeraPro high productivity features of the TeraStar platform have been extended to the die-to- database mode providing the opportunity to use STARlight and die-to-database modes concurrently. The system design and in-house test results are discussed.

Citation Download Citation

William Waters Volk, William H. Broadbent, Hector I. Garcia, Sterling G. Watson, Phillip Lim, and Wayne E. Ruch "Multibeam resolution die-to-database reticle inspection", Proc. SPIE 4764, 18th European Conference on Mask Technology for Integrated Circuits and Microcomponents, (16 August 2002); https://doi.org/10.1117/12.479351

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
11 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Inspection

Reticles

Image transmission

Databases

Data modeling

Defect detection

Optical proximity correction

Show All Keywords

Keywords/Phrases

Search In:

Publication Years