Paper
25 October 2004 Low-cost and highly manufacturable 30-Gb/s parallel optical transmitter module
Yi-Ming Chen, Yao-Ling Cheng, Ying-Chin Chen, Cherng-Shiun Wu, Mu-Tao Chu
Author Affiliations +
Abstract
This paper describes a 12-channels parallel optical transmitter module with a MPO-Connector designed for a very short reach OC-192 and SNAP 12 specifications. It is important to design the micro array lens for better couple efficiency of array optical transmitter module. The authors design the high accuracy micro array lens for injection modeling to reduce the price and suit for further mass production. In this 12-channel parallel optical transmitter module, it is very difficult to posit the chip on correct position according to guide pin or guide pin hole. Therefore, the authors develop the method of two steps flip chip bonding to release the difficulty of chip alignment on ceramic substrate without two guide pin holes. The performance of the module is demonstrated to fulfill the requirements of SNAP 12[1]. The extinction ratio of the 12-channels array transmitter module is tested above 6dB, respectively. The optical shift by heat is an important factor affecting the performance of the array module. Thermal analysis of 12-channel parallel optical transmitter module is used to improve the effect of optical shift by heat in this paper. And the temperature among the case of transmitter module is greatly reduced from 52.7 degree to 31.9 degree. In this paper, a 12-channel array transmitter module package and thermal simulation are discussed and tested. This is a low cost package design and is suitable for mass production.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yi-Ming Chen, Yao-Ling Cheng, Ying-Chin Chen, Cherng-Shiun Wu, and Mu-Tao Chu "Low-cost and highly manufacturable 30-Gb/s parallel optical transmitter module", Proc. SPIE 5595, Active and Passive Optical Components for WDM Communications IV, (25 October 2004); https://doi.org/10.1117/12.571319
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KEYWORDS
Transmitters

Optics manufacturing

Aluminum

Vertical cavity surface emitting lasers

Aluminum nitride

Temperature metrology

Thermal analysis

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