Flip chip VCSEL arrays on transparent substrates

Bryan Gregory; Randy Wickman

doi:10.1117/12.601943

14 March 2005 Flip chip VCSEL arrays on transparent substrates

Bryan Gregory, Randy Wickman

Proceedings Volume 5737, Vertical-Cavity Surface-Emitting Lasers IX; (2005) https://doi.org/10.1117/12.601943
Event: Integrated Optoelectronic Devices 2005, 2005, San Jose, California, United States

Abstract

In this report, we will discuss a method utilized by Emcore to flip-chip VCSEL die arrays onto transparent substrates, which contain integrated lensing and hybrid drive circuits. This process enables very dense hybrid packages.

Citation Download Citation

Bryan Gregory and Randy Wickman "Flip chip VCSEL arrays on transparent substrates", Proc. SPIE 5737, Vertical-Cavity Surface-Emitting Lasers IX, (14 March 2005); https://doi.org/10.1117/12.601943

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