Advanced microlithography process with multiple-chemical trim technology

Te Hung Wu; Ling Chieh Lin; C. L. Lin

doi:10.1117/12.598447

4 May 2005 Advanced microlithography process with multiple-chemical trim technology

Te Hung Wu, Ling Chieh Lin, C. L. Lin

Proceedings Volume 5753, Advances in Resist Technology and Processing XXII; (2005) https://doi.org/10.1117/12.598447
Event: Microlithography 2005, 2005, San Jose, California, United States

Abstract

Shrinkage technologies have attracted much more attention recently. The main shrinkage techniques are either to generate a thermal flow in the photo-resist with a high-temperature baking process, or to form a top layer with mixing bake treatment. In this paper, United Microelectronics Corporation (UMC) introduces a new shrinkage technology called MCTP (multiple Chemical Trim Process) and present the experimental results for our evaluation of the MCTP to implement the 90nm gate layer. Furthermore, this paper focuses on the correlation between developer process and mixing bake treatment, which has greatly benefits process window and leads to good line-edge roughness (LER) performance, especially for line-end shortening.

Citation Download Citation

Te Hung Wu, Ling Chieh Lin, and C. L. Lin "Advanced microlithography process with multiple-chemical trim technology", Proc. SPIE 5753, Advances in Resist Technology and Processing XXII, (4 May 2005); https://doi.org/10.1117/12.598447

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