On the modeling of piezoelectric wafer active sensor impedance analysis for structural health monitoring

Bin Lin; Victor Giurgiutiu

doi:10.1117/12.658521

5 April 2006 On the modeling of piezoelectric wafer active sensor impedance analysis for structural health monitoring

Bin Lin, Victor Giurgiutiu

Proceedings Volume 6174, Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems; 61740A (2006) https://doi.org/10.1117/12.658521
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2006, San Diego, California, United States

Abstract

Structural health monitoring (SHM) is important for reducing maintenance costs while increasing safety and reliability. Piezoelectric wafer active sensors (PWAS) used in SHM applications are able to detect structural damage using Lamb waves. PWAS are small, lightweight, unobtrusive, and inexpensive. PWAS achieve direct transduction between electric and elastic wave energies. PWAS are essential elements in the Lamb-wave SHM with pitch-catch, pulse-echo, phased array system and electromechanical impedance methods. This paper starts with the state of the art on the impedance method for PWAS applications. Then, finite element impedance model for free and bonded PWAS with different sizes and shapes will be given. Experiments showed that the real part and imaginary part of PWAS had different usage. Applications of impedance-based structural health monitoring indicate impedance method as a good candidate for damage detection and sensor durability verification for SHM smart sensor.

Citation Download Citation

Bin Lin and Victor Giurgiutiu "On the modeling of piezoelectric wafer active sensor impedance analysis for structural health monitoring", Proc. SPIE 6174, Smart Structures and Materials 2006: Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems, 61740A (5 April 2006); https://doi.org/10.1117/12.658521

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