Monolithically integrated transceiver chips for bidirectional optical interconnection

Martin Stach; Manikandan Chandran; Fernando Rinaldi; Steffen Lorch; Ihab Kardosh; Hendrik Roscher; Philipp Gerlach; Rainer Michalzik

doi:10.1117/12.662819

21 April 2006 Monolithically integrated transceiver chips for bidirectional optical interconnection

Martin Stach, Manikandan Chandran, Fernando Rinaldi, Steffen Lorch, Ihab Kardosh, Hendrik Roscher, Philipp Gerlach, Rainer Michalzik

Author Affiliations +

Proceedings Volume 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration; 61850Q (2006) https://doi.org/10.1117/12.662819
Event: SPIE Photonics Europe, 2006, Strasbourg, France

Abstract

We report on the design, fabrication and test results of monolithically integrated transceiver chips consisting of GaAs metal-semiconductor-metal photodiodes and 850nm wavelength vertical-cavity surface-emitting lasers. These chips are well suited for low-cost and compact bidirectional optical interconnection at Gbit/s data rates in mobile systems and industrial or home networks employing large core size multimode fibers.

Citation Download Citation

Martin Stach, Manikandan Chandran, Fernando Rinaldi, Steffen Lorch, Ihab Kardosh, Hendrik Roscher, Philipp Gerlach, and Rainer Michalzik "Monolithically integrated transceiver chips for bidirectional optical interconnection", Proc. SPIE 6185, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, 61850Q (21 April 2006); https://doi.org/10.1117/12.662819

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