Chip-to-chip optical link by using optical wiring method

In-Kui Cho; Seoung Ho Ahn; Myung-Yung Jeong; Byung Sup Rho; Hyo Hoon Park

doi:10.1117/12.770816

8 January 2008 Chip-to-chip optical link by using optical wiring method

In-Kui Cho, Seoung Ho Ahn, Myung-Yung Jeong, Byung Sup Rho, Hyo Hoon Park

Author Affiliations +

Proceedings Volume 6801, Photonics: Design, Technology, and Packaging III; 68011M (2008) https://doi.org/10.1117/12.770816
Event: SPIE Microelectronics, MEMS, and Nanotechnology, 2007, Canberra, ACT, Australia

Abstract

A practical optical link system was prepared with a transmitter (Tx) and receiver (Rx). The optical TRx module consisted of a metal optical bench, a module printed circuit board (PCB), a driver/receiver IC, a VCSEL/PD array, and an optical link block composed of plastic optical fiber (POF). For the optical interconnection between the light-sources and detectors, an optical wiring method has been proposed to enable easy assembly. This paper provides a method for optical interconnection between an optical Tx and an optical Rx, comprising the following steps: (a) forming a light source device, an optical detection device, and an optical transmission unit on a substrate (metal optical bench (MOB)); (b) preparing a flexible optical transmission-connection medium (optical wiring link) to optically connect the light source device formed on the substrate with the optical detection device; and (c) directly connecting one end of the surface-finished optical transmission connection medium with the light source device and the other end with the optical detection device. A chip-to-chip optical link system constructed with TRx modules was fabricated and the optical characteristics were measured. The results clearly demonstrate that the use of an optical wiring method can provide robust and cost-effective assembly for vertical-cavity surface-emitting lasers (VCSELs) and photodiodes (PDs). We successfully achieved a 5 Gb/s data transmission rate with this optical link.

Citation Download Citation

In-Kui Cho, Seoung Ho Ahn, Myung-Yung Jeong, Byung Sup Rho, and Hyo Hoon Park "Chip-to-chip optical link by using optical wiring method", Proc. SPIE 6801, Photonics: Design, Technology, and Packaging III, 68011M (8 January 2008); https://doi.org/10.1117/12.770816

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KEYWORDS

Phase only filters

Vertical cavity surface emitting lasers

Receivers

Metals

Packaging

Optical benches

Polymethylmethacrylate

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