Evaluation of transfer of particles from dual-pod base plate to EUV mask

Masami Yonekawa; Kazuya Ota; Takao Taguchi; Osamu Suga

doi:10.1117/12.867044

26 May 2010 Evaluation of transfer of particles from dual-pod base plate to EUV mask

Masami Yonekawa, Kazuya Ota, Takao Taguchi, Osamu Suga

Author Affiliations +

Proceedings Volume 7748, Photomask and Next-Generation Lithography Mask Technology XVII; 774820 (2010) https://doi.org/10.1117/12.867044
Event: Photomask and NGL Mask Technology XVII, 2010, Yokohama, Japan

Abstract

Since 2005, Canon, Nikon, and Entegris have been jointly developing an EUV mask carrier based on the "Dual Pod" concept in place of a pellicle. By using our MIRAI-Selete Mask Protection Engineering (MPE) tool, a few prototypes were tested for performance of particle protection in the case of both mask shipping and its handling in vacuum. As a result, the fundamental mechanical specifications of the Dual pod were registered as those of SEMI "E152" of an EUV Pod used in EUV mask. It is found that the latest pod named "cnPod", which is based on the SEMI E152, performs almost satisfactorily. Although superior protection performance with respect to external particles has been confirmed, the performance with respect to internal particles laid on the base plate of an inner pod is still under investigation. Therefore, we evaluate the influence of the internal particles laid on the base-plate surface for the first time. In order to confirm whether the particles on the base plate are transferred to the mask-patterned surface, well-characterized particles are dispersed on the base-plate surface. By using this contaminated base plate and the MPE tool, mask handling experiments are conducted. Under our experimental conditions, it is found that the number of test particles transferred to the mask surface is very low compared to the total number of particles on the base-plate surface.

Citation Download Citation

Masami Yonekawa, Kazuya Ota, Takao Taguchi, and Osamu Suga "Evaluation of transfer of particles from dual-pod base plate to EUV mask", Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 774820 (26 May 2010); https://doi.org/10.1117/12.867044

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