A high density design of Schottky-barrier diode array with self-aligned nickel-silicidation under 40nm technology node fabricated on epitaxial layer for low power phase-change memory application is proposed. According to N-type doping profile from simulation, large ON/OFF current ratio, the lower barrier height of ФB and series resistance RS are all determined by the dosage of buried N+ layer, epitaxial layer thickness. In addition, the temperature effect of the Schottky diode array is demonstrated by I-V electrical characteristics. From the optimal silicon-based results, a 9F2 16 × 16 diode array with the ideality factor of 1.21~1.40 shows a drive current density of ~14.9 mA/μm2, a Jon/Joff ratio of ~5.17×103, and crosstalk immunity. Furthermore, this calibrated physical model makes it possible to predict and improve the performance of accessing device array next generation for non-volatile memory application.
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