Modelling and predicting hidden solder joint shape using active thermography and parametric numerical analysis

Jose Benjamin Giron Palomares; Sheng-Jen Hsieh

doi:10.1117/12.2053393

21 May 2014 Modelling and predicting hidden solder joint shape using active thermography and parametric numerical analysis

Jose Benjamin Giron Palomares, Sheng-Jen Hsieh

Author Affiliations +

Proceedings Volume 9105, Thermosense: Thermal Infrared Applications XXXVI; 91050Q (2014) https://doi.org/10.1117/12.2053393
Event: SPIE Sensing Technology + Applications, 2014, Baltimore, MD, United States

Abstract

A methodology based on active infrared thermography to study and characterize hidden solder joint shapes on a multi cover PCB assembly was investigated. A numerical model was developed to simulate the active thermography methodology and was proven to determine the grand average cooling rates with maximum errors of 8.85% (one cover) and 13.36% (two covers). A parametric analysis was performed by varying the number of covers, heat flux provided, and the amount of heating time. Grand average cooling rate distances among contiguous solder joint shapes, as well as solder joints discriminability, were determined to be directly proportional to heat flux, and inversely proportional to the number of covers and heating time. Finally, a mathematical model was developed to determine the appropriate total amount of energy needed to discriminate among hidden solder joints with a “good” discriminability for one and two covers, and a “regular” discriminability for up to five covers. The mathematical model was proven to predict the total amount of energy to achieve a “good” discriminability for one cover within a 10% of error with respect to the experimental active thermography model.

Citation Download Citation

Jose Benjamin Giron Palomares and Sheng-Jen Hsieh "Modelling and predicting hidden solder joint shape using active thermography and parametric numerical analysis", Proc. SPIE 9105, Thermosense: Thermal Infrared Applications XXXVI, 91050Q (21 May 2014); https://doi.org/10.1117/12.2053393

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