Paper
17 October 2014 EUV lithography: progress, challenges, and outlook
Author Affiliations +
Proceedings Volume 9231, 30th European Mask and Lithography Conference; 923103 (2014) https://doi.org/10.1117/12.2076766
Event: 30th European Mask and Lithography Conference, 2014, Dresden, Germany
Abstract
Extreme Ultraviolet Lithography (EUVL) has been in the making for more than a quarter century. The first EUVL production tools have been delivered over the past year and chip manufacturers and suppliers are maturing the technology in pilot line mode to prepare for high volume manufacturing (HVM). While excellent progress has been made in many technical and business areas to prepare EUVL for HVM introduction, there are still critical technical and business challenges to be addressed before the industry will be able to use EUVL in HVM.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
S. Wurm "EUV lithography: progress, challenges, and outlook", Proc. SPIE 9231, 30th European Mask and Lithography Conference, 923103 (17 October 2014); https://doi.org/10.1117/12.2076766
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Cited by 6 scholarly publications.
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KEYWORDS
Extreme ultraviolet

Extreme ultraviolet lithography

Photomasks

Manufacturing

Optical lithography

Inspection

Logic

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