In recent years the promise of EUV lithography became a high-volume-manufacturing reality and is currently the main enabler for the latest generations of chips we all know and use.
To enable the future generations of chips, with smaller feature sizes ZEISS and ASML are developing a new generation of EUV tools, with an increased NA from the current 0.33 to 0.55 allowing the lithographers to print 8nm half-pitch in a single exposure.
In this presentation we will remind briefly on high-NA optics concepts as compared to its 0.33-NA predecessor. We will give insight into how advanced the current production status at ZEISS is: not only into mirror surface polishing, coating, metrology, but also mirror handling and integration as well as shipment. Moreover, besides what happens in high-NA program, you will also see the current status and ongoing improvements to 0.33-NA optics.
|