Presentation
30 April 2023 A ML based OPC model pattern down-selection method with mask and wafer contours
Author Affiliations +
Abstract
This conference presentation was prepared for the Advanced Etch Technology and Process Integration for Nanopatterning XII conference at SPIE Advanced Lithography + Patterning 2023.
Conference Presentation
© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xuefeng Zeng, Yuansheng Ma, Yixiao Zhang, and Yuyang Sun "A ML based OPC model pattern down-selection method with mask and wafer contours", Proc. SPIE PC12499, Advanced Etch Technology and Process Integration for Nanopatterning XII, PC1249905 (30 April 2023); https://doi.org/10.1117/12.2662778
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KEYWORDS
Optical proximity correction

Photomasks

Semiconducting wafers

Scanning electron microscopy

Calibration

Machine learning

Optical simulations

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