As technology advances, the need for precise and reliable track systems became crucial to enable high-performance and reliable semiconductor manufacturing. Progressive track development boosts several metrics like defectivity, critical dimension uniformity (CDU), line width roughness (LWR) and pattern shape. In this work, we investigate and improve the defect levels for different EUV resist platforms using SCREEN’s DT-3000 coat-develop track system. Additionally, we showcase the recent advancements on DT-3000 track to improve CD uniformity, a metric that plays a vital role in EUVL as it ensures consistent and precise dimensions printed on the chips. Through an innovative post-exposure bake hotplate design, we introduce a pioneer solution to correct process fingerprints that affect the CD stability across the wafer, thus meeting the challenging demands of advanced generation semiconductor manufacturing.
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