PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
Many advanced applications require high throughput, high removal rate processing of silicon and polysilicon materials with very low surface roughness. This presentation will focus on the latest consumable sets for processing silicon and polysilicon to achieve high removal rate and very low surface roughness. We will present the polishing results using double sided polishing tools from different consumables showing the effects of changing slurries, pads and cleaning chemistry on polishing results. This presentation present data on current generation and next generation consumables to show how the optimization of new slurries and pads can achieve high removal rate and very low surface roughness.
Floyd McClung
"Next generation polishing consumables for silicon and polysilicon to achieve very low surface roughness with high throughput", Proc. SPIE PC12778, Optifab 2023, PC1277808 (30 November 2023); https://doi.org/10.1117/12.2692020
ACCESS THE FULL ARTICLE
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Floyd McClung, "Next generation polishing consumables for silicon and polysilicon to achieve very low surface roughness with high throughput," Proc. SPIE PC12778, Optifab 2023, PC1277808 (30 November 2023); https://doi.org/10.1117/12.2692020