Presentation
16 March 2024 MOCVD process for 10 um+ thick β-Ga2O3 drift layers and doping control
Andrei V. Osinsky, Fikadu Alema, Aaron Fine
Author Affiliations +
Proceedings Volume PC12887, Oxide-based Materials and Devices XV; PC128870H (2024) https://doi.org/10.1117/12.3011184
Event: SPIE OPTO, 2024, San Francisco, California, United States
Abstract
This paper presents the advantages and disadvantages of using triethylgallium (TEGa) and trimethylgallium (TMGa) for realization of high-purity, carbon-free, epitaxial Ga2O3 films. Critical process conditions and MOCVD reactor geometries on achieving high purity β-Ga2O3 films with high electron mobility and low background carrier concentration, including doping control in this range, will be discussed. This paper will also discuss the MOCVD growth of high Al composition (up to 30%) high quality strained β-(AlGa)2O3/Ga2O3 heterostructures. To obtain semi insulating films, we will discuss Ga2O3 doping with nitrogen, comparing various nitrogen precursors. We will present the limitations of MOCVD technique for achieving heavily doped (>1020 1/cm3), highly conductive β-Ga2O3. We will present a new in-situ etching process for Ga2O3 in MOCVD using Ga and Cl based chemistry.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Andrei V. Osinsky, Fikadu Alema, and Aaron Fine "MOCVD process for 10 um+ thick β-Ga2O3 drift layers and doping control ", Proc. SPIE PC12887, Oxide-based Materials and Devices XV, PC128870H (16 March 2024); https://doi.org/10.1117/12.3011184
Advertisement
Advertisement
KEYWORDS
Metalorganic chemical vapor deposition

Doping

Etching

Heterojunctions

Nitrogen

Projection devices

Resistance

Back to Top