Journal of Micro/Nanopatterning, Materials, and Metrology

Editor-in-Chief: Harry Levinson, HJL Lithography, USA

The Journal of Micro/Nanopatterning, Materials, and Metrology (JM 3) publishes peer-reviewed papers on the core enabling technologies that address the patterning needs of the electronics industry. Formerly the Journal of Micro/Nanolithography, MEMS, and MOEMS, the journal’s key subject areas include the science, development, and practice of lithographic, computational, etch, and integration technologies. In this context the electronics industry includes but is not limited to integrated circuits and multichip modules, and advanced packaging with features in the submicron regime.

On the cover: The figure is from the Gold Open Access paper "Multi-beam mask writing opens up new fields of application, including curvilinear mask pattern for high numerical aperture extreme ultraviolet lithography" by Mathias Tomandl et al. in the Speical Section on Curvilinear Masks , Part 1, guest-edited by Linyong (Leo) Pang and Danping Peng.

Featured Content

Special Section on Patterning for Advanced Packaging

Special Section Editors: Ken-ichiro Mori and Moshe Preil

Pushing the boundaries of patterning: a conversation with Tatiana Kovalevich

Harry Levinson

Special Section on Curvilinear Masks

Special Section Editors: Linyong (Leo) Pang and Danping Peng

Previously Published Special Sections

from the Journal of Micro/Nanopatterning, Materials, and Metrology


Curvilinear Masks, Part 1

Guest Editors: Lingong (Leo) Pang and Danping Peng


Plasma Modeling and Feature Profile Simulation

Guest Editors: Catherine B. Labelle and Mark J. Kushner


Control of Integrated Circuit Patterning Variance, Part 5: Pattern Placement, Critical Dimension, and Edge-to-Edge Overlay (October-December 2023)

Guest Editor: Alexander Starikov


Direct Write Lithography (October-December 2023)

Guest Editors: Stephen Renwick and Laurent Pain


3D Semiconductor Metrology (July-September 2023)

Guest Editors: Ndubuisi George Orji and Qinghuang Lin


Advances in E-Beam Metrology (April-June 2023)

Guest Editors: Gian Francesco Lorusso and Chris A. Mack


Manufacturing Data Analytics (October-December 2022)

Guest Editors: Bertrand Le-Gratiet and Serap Savari


Non-chemically Amplified Resists for EUV Lithography (October-December 2022)

Guest Editors: Anjua DeSilva and Yasin Ekinci


Next Generation Light Source, Materials, and Metrology/Inspection Equipment (April-June 2022)

Guest Editors: Erik R. Hosler and Brennan Peterson


Novel Patterning Technologies II (January-March 2022)

Guest Editors: Doug Resnick and Eric Panning


Journal Metrics:
ISSN: 1932-5150
E-ISSN: 2708-8340 
CiteScoreTM 2022: 2.9
Impact Factor *: 2.3
h5-index: 20
*Source: Journal Impact Factor TM, from Clarivate, 2023

Author Benefits:

  • Rigorous and prompt peer review
  • Rapid, e-first publication of articles
  • Professional copyediting and typesetting
  • Free online color figures
  • Free inclusion of videos and multimedia 
  • Open access publication option at a low cost
  • 5 free downloads from the SPIE Digital Library for authors
  • Integration with Code Ocean, a cloud-based code development and publishing platform

 


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