1 January 2009 High-reliability flexible optical printed circuit board for opto-electric interconnections
Byung Sup Rho, Woo Jin Lee, Jung Woon Lim, Gye Won Kim, Che Hyun Cho, Sung Hwan Hwang
Author Affiliations +
Abstract
A rigid flexible optical electrical printed circuit board (RFOE-PCB) with both electrical layers and an optical layer was fabricated using a conventional PCB manufacture process. The RFOE-PCB is applicable to fold-type mobile devices such as mobile phones and laptop computers. The RFOE-PCB was designed to be embedded with a flexible 45-deg-ended optical waveguide, which was made using a polymeric material. The precise lamination between an electrical layer and an optical layer was achieved by a passive alignment method. We carried out the repetitive folding test and an environment test for physical and optical reliability suitable for mobile devices. Data transmission of 2.5 Gb/s was demonstrated with a clear eye diagram using the fabricated RFOE-PCB.
©(2009) Society of Photo-Optical Instrumentation Engineers (SPIE)
Byung Sup Rho, Woo Jin Lee, Jung Woon Lim, Gye Won Kim, Che Hyun Cho, and Sung Hwan Hwang "High-reliability flexible optical printed circuit board for opto-electric interconnections," Optical Engineering 48(1), 015401 (1 January 2009). https://doi.org/10.1117/1.3072957
Published: 1 January 2009
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CITATIONS
Cited by 5 scholarly publications.
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KEYWORDS
Waveguides

Mobile devices

Vertical cavity surface emitting lasers

Optical printed circuit boards

Optical alignment

Optics manufacturing

Palladium

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