Mitigation of surface damage growth by hydrofluoric acid etching combined with carbon dioxide laser treatment

Yong Jiang; Chengsi Luo; Chunming Liu; Xia Xiang; Xiaotao Zu; Xiaodong Yuan; Shaobo He; Wanguo Zheng; Haijun Wang; Haibing Lv; Wei Ren

doi:10.1117/1.OE.51.8.084301

2 August 2012 Mitigation of surface damage growth by hydrofluoric acid etching combined with carbon dioxide laser treatment

Yong Jiang, Chengsi Luo, Chunming Liu, Xia Xiang, Xiaotao Zu, Xiaodong Yuan, Shaobo He, Wanguo Zheng, Haijun Wang, Haibing Lv, Wei Ren

Author Affiliations +

Funded by: Fundamental Research Funds for the Central Universities, NSAF Joint Foundation of China, Foundation for Young scholars of University of Electronic Science and Technology of China

Optical Engineering, Vol. 51, Issue 8, 084301 (August 2012). https://doi.org/10.1117/1.OE.51.8.084301

Abstract

Damage sites as large as 600 μm in fused silica surface were successfully mitigated with a new protocol by hydrofluoric acid (HF) etching combined with carbon dioxide laser treatment. The damage sites were first etched in 40% HF solution to blunt the fractures, and then the etched damage sites were smoothed with a CO₂ laser. It has been found that the etching rate of damaged material in the lateral direction is larger than in the longitudinal direction; thus, an optimized etching time was chosen to etch the damage sites based on the etching ratio. Three types of damage test methods were used to confirm the mitigation efficiency of the protocol. The results indicate that the damage resistance capability of mitigated sites can recover to the level of pristine substrate.

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Yong Jiang, Chengsi Luo, Chunming Liu, Xia Xiang, Xiaotao Zu, Xiaodong Yuan, Shaobo He, Wanguo Zheng, Haijun Wang, Haibing Lv, and Wei Ren "Mitigation of surface damage growth by hydrofluoric acid etching combined with carbon dioxide laser treatment," Optical Engineering 51(8), 084301 (2 August 2012). https://doi.org/10.1117/1.OE.51.8.084301

Published: 2 August 2012

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