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Chun-Chieh Chen
Senior Photo Solution Engineer at KLA-Tencor Taiwan
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Publications (4)
Proceedings Article | 2 April 2010 Paper
Detection of photo resist residue on advanced gate layers using optical scattering and advanced analysis techniques
Scott Ku, Ying-Hsueh Chang Chien, C. Yang, Elvis Wang, Damian Chen, Chris Young, Kevin Sun, Jack Yan, Prasanna Dighe, Avinash Saldanha, David Feiler
Proceedings Volume 7638, 76383F (2010) https://doi.org/10.1117/12.847797
KEYWORDS: Semiconducting wafers, Luminescence, Air contamination, Scattering, Wafer-level optics, Process control, Metrology, Inspection, Metals, Signal attenuation
Proceedings Article | 11 May 2009 Paper
A new approach to reticle haze defect management in the fab
Yeu-Dong Gau, Kevin Hsiao, Wen-Hao Hsu, Yu-Min Lu, Chun-Chieh Chen, Chen Min Liu, Mike Van Riet, Noah Gaspar, Chien-Chun Yu, Phillip Chan
Proceedings Volume 7379, 73791H (2009) https://doi.org/10.1117/12.824294
KEYWORDS: Reticles, Semiconducting wafers, Inspection, Air contamination, Wafer inspection, Defect detection, Defect inspection, Dysprosium, Software development, Photomasks
Proceedings Article | 4 December 2008 Paper
Accelerating 32nm BEOL technology development by advanced wafer inspection methodology
P. R. Jeng, C. Lin, Simon Jang, M. Liang, Wallas Chen, David Tsui, Damian Chen, Henry Chen, Chris Young, Ellis Chang
Proceedings Volume 7140, 71400S (2008) https://doi.org/10.1117/12.804526
KEYWORDS: Inspection, Photomasks, Optical proximity correction, Wafer inspection, Back end of line, Library classification systems, Semiconducting wafers, Copper, Defect inspection, Semiconductor manufacturing
Proceedings Article | 4 December 2008 Paper
Lithography hotspot discovery at 70nm DRAM 300mm fab: process window qualification using design base binning
Daniel Chen, Damian Chen, Ray Yen, Mingjen Cheng, Andy Lan, Rajesh Ghaskadvi
Proceedings Volume 7140, 71400R (2008) https://doi.org/10.1117/12.804563
KEYWORDS: Scanning electron microscopy, Semiconducting wafers, Inspection, Lithography, Modulation, Resolution enhancement technologies, Data analysis, Finite element methods, Defect inspection, Scanners
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