We have demonstrated a high efficiency package for zero bias Sb-based backward tunnel diodes developed for passive millimeter wave imaging. Flip-chip mounting of detector MMICs onto quartz substrates permit placement of the detector directly within the WR-10 waveguide feeds for diagonal horn antennas. This arrangement minimizes the losses between the detectors and antennas while providing an impedance match over a majority of W band. A 2x2 array of radiometers was fabricated, assembled, and measured using coherent measurement techniques. The resulting noise equivalent temperature difference, calculated assuming a 30 Hz frame rate is 10 degrees K.
Microelectromechanical system (MEMS) RF components for millimeterwave reconfigurable transceivers are investigated. The components include reconfigurable Vee-antennas, sliding planar impedance tuners, microswitches and variable capacitors. These different components are fabricated using the same three-layer-polysilicon surface micromachining techniques. In this work, we focus on the demonstration of component architectures and the integration issues. The reconfigurability of the Vee-antenna is demonstrated with beam-steering and beam-shaping functionality. The antenna characteristics are also studied. The planar feature of the Vee-antennas allows integration of planar impedance tuners. The antenna impedance can be matched dynamically by two shunt sliding planar backshort impedance tuners. The tuning ranges of planar backshort impedance tuners on different transmission lines are studied. The mechanical architectures for microswitches, parallel-plate variable capacitors and circular variable capacitors are also investigated.
Conference Committee Involvement (7)
Micromachining and Microfabrication Process Technology XVI
25 January 2011 | San Francisco, California, United States
Micromachining and Microfabrication Process Technology XV
26 January 2010 | San Francisco, California, United States
Micromachining and Microfabrication Process Technology XIV
27 January 2009 | San Jose, California, United States
Micromachining and Microfabrication Process Technology XIII
22 January 2008 | San Jose, California, United States
Micromachining and Microfabrication Process Technology XII
22 January 2007 | San Jose, California, United States
Micromachining and Microfabrication Process Technology XI
25 January 2006 | San Jose, California, United States
Device and Process Technologies for Microelectronics, MEMS, and Photonics IV
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