Mr. Feng Hao Chang Profile

Feng Hao Chang

SPIE Involvement:

Author

Publications (1)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 21 November 2023 Presentation + Paper

EUV pellicle technology for high volume wafer production

Yun-Yao Lin, Pei-Hsun Tsai, Kelvin Elphick, Ching-Ho Hsu, Dino K. Shieh, Feng Hao Chang, James C. Huang, Jerry C. Chen, Vincent C. Wen

Proceedings Volume 12750, 127500N (2023) https://doi.org/10.1117/12.2688127

KEYWORDS: Pellicles, Extreme ultraviolet, Extreme ultraviolet lithography, Semiconducting wafers, Reticles, Scanners, Inspection, High volume manufacturing, Transmittance, Contamination

Read Abstract +

EUV lithography is a key technology in the semiconductor industry and using pellicle that protects reticle from contamination during lithography process has become increasingly important. In this paper, different types of pellicles showing 82~>95% EUV transmittance and wafer moves 5K~50k under different transmittances, scanner powers and resists have been demonstrated for high volume wafer production at this work. For pellicle particle quality, we developed new inspection tool to achieve >1um pinhole-free and with significant defectivity reduction compared to previous one. Almost no fall-on rate is validated for real wafer production. Furthermore, this work develops full infrastructure, which include pellicle-making, pellicle-mounting and through pellicle inspection are validated to provide simple and robust production capability. Our EUV pellicle frame design shows fully compatibility with advanced 193nm reticle pelliclemounting process. Now previous EUV pellicle solution is ready to support advanced nodes application. The other key indices for high wafer throughput and cost reduction are high pellicle transmittance and durability. The pellicle optical performances (EUV transmittance, EUVT uniformity and EUV reflectance) are comparable to the previous solution. Moreover, no negative effects on wafer critical dimension uniformity (CDU) regarding to mask with and without pellicle mounting. In this work, a high-volume manufacturing (HVM) EUV pellicle with excellent defect and durability have been successfully qualified for the needs of advanced node productions.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years