We report on a new manufacturing paradigm to build scalable microbolometers at the lowest cost possible. A VGA microbolometer focal plane array has been designed and fabricated using flat panel display production tools, using the Large Area MEMS Platform (LAMP). Complex MEMs sensors have been integrated with Low Temperature Polysilicon (LTPS) transistors on a Gen 3.5 glass substrate in a display production fab to realize an order of magnitude gain in the number of devices per substrate. In this modular approach, a custom readout integrated circuit (ROIC) is bonded to the glass focal plane with the Chip on Flex (COF) technique, a high volume and low-cost staple of the display industry. We discuss the potential implications of the pricing disruption to important commercial applications.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.