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Hosoon Shin
Research Engineer at LG Electronics
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Publications (1)
Proceedings Article | 28 March 2014 Paper
Analysis and optimization of process-induced electromigration on signal interconnects in 16nm FinFET SoC (system-on-chip)
Yongchan Ban, Changseok Choi, Hosoon Shin, Yongseok Kang, Woo Hyun Paik
Proceedings Volume 9053, 90530P (2014) https://doi.org/10.1117/12.2046207
KEYWORDS: Signal processing, Metals, Clocks, Logic, Chemical mechanical planarization, Lithography, Etching, Design for manufacturing, Resistance
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