Mr. Ihor Mys Profile

Ihor Mys

at Bayerisches Laserzentrum GmbH

SPIE Involvement:

Author

Publications (2)

This will count as one of your downloads.

You will have access to both the presentation and article (if available).

DOWNLOAD NOW

This content is available for download via your institution's subscription. To access this item, please sign in to your personal account.

Email or Username Forgot your username?

Password Forgot your password?

Show

Keep me signed in

No SPIE account? Create an account

Proceedings Article | 20 March 2007 Paper

Laser-based rework in electronics production

Florian Albert, Ihor Mys, Michael Schmidt

Proceedings Volume 6459, 645905 (2007) https://doi.org/10.1117/12.703125

KEYWORDS: Laser welding, Lead, Tin, Copper, Electronics, Laser scanners, 3D scanning, Scanners, Process control, Electronic components

Read Abstract +

Despite the electronic manufacturing is well-established mass production process for a long time, the problem of reworking, i.a. reject and replace of defect components, still exists. The rework operations (soldering, replacement and desoldering) are performed in most cases manually. However, this practice is characterized by an inconsistent quality of the reworked solder joints and a high degree of physiological stress for the employees. In this paper, we propose a novel full-automated laser based soldering and rework process. Our developed soldering system is a pick-and-place unit with an integrated galvanometer scanner, a fiber coupled diode laser for quasi-simultaneous soldering and a pyrometer-based process control. The developed system provides soldering and reworking processes taking into account a kind of defect, a type of electronic component and quality requirements from the IPC- 610 norm. The paper spends a great deal of efforts to analyze quality of laser reworked solder joints. The quality depends mainly on the type and thickness of intermetallic phases between solder, pads and leads; the wetting angles between pad, solder and lead; and finally, the joint microstructure with its mechanical properties. The influence of the rework soldering on these three factors is discussed and compared to conventional laser soldering results. In order to optimize the quality of reworked joints, the different strategies of energy input are applied.

Proceedings Article | 23 February 2006 Paper

Laser micro welding of copper and aluminum

Ihor Mys, Michael Schmidt

Proceedings Volume 6107, 610703 (2006) https://doi.org/10.1117/12.648376

KEYWORDS: Copper, Aluminum, Silver, Tin, Nickel, Laser welding, Interfaces, Metals, Manufacturing, Yield improvement

Read Abstract +

Aluminum combines comparably good thermal and electrical properties with a low price and a low material weight. These properties make aluminum a promising alternative to copper for a large number of electronic applications, especially when manufacturing high volume components. However, a main obstacle for a wide use of this material is the lack of a reliable joining process for the interconnection of copper and aluminum. The reasons for this are a large misalignment in the physical properties and even more a poor metallurgical affinity of both materials that cause high crack sensitivity and the formation of brittle intermetallic phases during fusion welding. This paper presents investigations on laser micro welding of copper and aluminum with the objective to eliminate brittle intermetallic phases in the welding structure. For these purposes a combination of spot welding, a proper beam offset and special filler material are applied. The effect of silver, nickel and tin filler materials in the form of thin foils and coatings in a thickness range 3-100 μm has been investigated. Use of silver and tin filler materials yields to a considerable improvement of the static and dynamic mechanical stability of welded joints. The analysis of the weld microstructure shows that an application even of small amounts of suitable filler materials helps to avoid critical, very brittle intermetallic phases on the interface between copper and solidified melt in the welded joints.

My Library

You currently do not have any folders to save your paper to! Create a new folder below.

Folder Name

Folder Description

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks. You are receiving this notice because your organization may not have SPIE eBooks access.*

*Shibboleth/Open Athens users─please sign in to access your institution's subscriptions.

To obtain this item, you may purchase the complete book in print or electronic format on SPIE.org.

ORGANIZATIONAL
Sign in with credentials provided by your organization.

Organizational Username

Organizational Password

Show/Hide Password

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members:

Non-members: ADD TO CART

Keywords/Phrases

Search In:

Publication Years