Mr. Johnson Chiang Profile

Johnson Chiang

Sr. Engineer at Cepheid

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Author

Publications (3)

Proceedings Article | 11 July 2002 Paper

Front-end wafer-level microsystem packaging technique with micro-cap array

Yuh-Min Chiang, Mark Bachman, Guann-pyng Li

Proceedings Volume 4700, (2002) https://doi.org/10.1117/12.475040

KEYWORDS: Semiconducting wafers, Packaging, Epoxies, Silicon, Polymers, Adhesives, Manufacturing, Wafer dicing, Wafer bonding, Microsystems

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Proceedings Article | 19 August 1999 Paper

Characterizing the process of cast molding microfluidic systems

Yuh-Min Chiang, Mark Bachman, Charles Chu, Guann-pyng Li

Proceedings Volume 3877, (1999) https://doi.org/10.1117/12.359350

KEYWORDS: Silicon, Polymers, Microfluidics, Epoxies, Surface roughness, Microfabrication, Scanning electron microscopy, Liquids, Glasses, Polyurethane

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Proceedings Article | 19 August 1999 Paper

Laminated microfluidic structures using a micromolding technique

Mark Bachman, Yuh-Min Chiang, Charles Chu, Guann-pyng Li

Proceedings Volume 3877, (1999) https://doi.org/10.1117/12.359331

KEYWORDS: Microfluidics, Polymers, Silicon, Adhesives, Oxygen, Prototyping, Metals, Liquids, Packaging, Biomedical optics

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