An IR diffraction interferometer is proposed for coplanarity measurement of high-density solder bump patterns. The method utilizes long-wavelength (= 10.6 µm) coherent infrared laser light, which serves to reduce the apparent roughness of test objects and enables the regularly spaced solder bump arrays to produce well-defined diffracted wavefronts. A single diffracted wavefront is isolated by an optical system and directed to interfere with a reference wavefront to produce a whole-field map of bump topography. An optical configuration similar to classical Fizeau interferometry is implemented to prove the concept.
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