Ryan Ley
at Applied Materials Inc
SPIE Involvement:
Author
Publications (2)

Proceedings Article | 9 April 2024 Presentation + Paper
Proceedings Volume 12957, 129570X (2024) https://doi.org/10.1117/12.3010203
KEYWORDS: Lithography, Packaging, Polyimides, Materials properties, Electrical properties, Dielectrics, Image processing, Film thickness, Chemical mechanical planarization, Advanced packaging

Proceedings Article | 5 March 2021 Presentation
Shubhra Pasayat, Chirag Gupta, Matthew Wong, Ryan Ley, Yifan Wang, Stacia Keller, Steven DenBaars, Shuji Nakamura, Umesh Mishra
Proceedings Volume 11706, 117060C (2021) https://doi.org/10.1117/12.2577008
KEYWORDS: Gallium nitride, Indium gallium nitride, Optoelectronics, Indium, Quantum wells, Light emitting diodes, Display technology, Aluminium gallium indium phosphide, Green light emitting diodes

SIGN IN TO:
  • View contact details

UPDATE YOUR PROFILE
Is this your profile? Update it now.
Don’t have a profile and want one?

Advertisement
Advertisement
Back to Top