This work demonstrates how optomechanical alignment inaccuracies affect the operation of a small port-count, fiber coupled, MOEMS switch using six degrees of freedom, parameterized behavioral models. Simulation results show that a control system is essential to stabilize the switch when it is subjected to the variations that would otherwise degrade its performance.
Joel Kubby, Jim Calamita, Jen-Tsorng Chang, Jingkuang Chen, Peter Gulvin, C.-C. Lin, Robert Lofthus, Bill Nowak, Yi Su, Alex Tran, David Burns, Janusz Bryzek, John Gilbert, Charles Hsu, Tom Korsmeyer, Arthur Morris, Thomas Plowman, Vladimir Rabinovich, Troy Daiber, Bruce Scharf, Andrew Zosel, Li Fan, Jim Hartman, Anis Husain, Nena Golubovic-Laikopoulos, Raji Mali, Tom Pumo, Steve Delvecchio, Shifang Zhou, Michel Rosa, Decai Sun
A multidisciplinary team of end users and suppliers has collaborated to develop a novel yet broadly enabling process for the design, fabrication and assembly of Micro-Opto- Electro-Mechanical Systems (MOEMS). A key goal is to overcome the shortcomings of the polysilicon layer used for fabricating optical components in a conventional surface micromachining process. These shortcomings include the controllability and uniformity of material stress that is a major cause of curvature and deformation in released microstructures. The approach taken by the consortium to overcome this issue is to use the single-crystal-silicon (SCS) device layer of a silicon-on-insulator (SOI) wafer for the primary structural layer. Since optical flatness and mechanical reliability are of utmost importance in the realization of such devices, the use of the silicon device layer is seen as an excellent choice for devices which rely on the optical integrity of the materials used in their construction. A three-layer polysilicon process consisting of two structural layers is integrated on top of the silicon device layer. This add-on process allows for the formation of sliders, hinges, torsional springs, comb drives and other actuating mechanisms for positioning and movement of the optical components. Flip-chip bonding techniques are also being developed for the hybrid integration of edge and surface emitting lasers on the front and back surfaces of the silicon wafer, adding to the functionality and broadly enabling nature of this process. In addition to process development, the MOEMS manufacturing Consortium is extending Micro-Electro-Mechanical Systems (MEMS) modeling and simulation design tools into the optical domain, and using the newly developed infrastructure for fabrication of prototype micro-optical systems in the areas of industrial automation, optical switching for telecommunications and laser printing.
A planar optical waveguide was used to simultaneously excite fluorescence due to antigen binding in three separate areas of immobilized antibody. Biotin labeled, polyclonal antibodies to goat, human, and rabbit IgG were immobilized through surface bound, photo-activated MeNPOC-biotin-bSA and avidin. Exposing the MeNPOC to UV light effectively uncaged the biotin molecule attached to the bSA and allowed avidin, followed by the biotin labeled antibody, to bind to the waveguide surface. Whereas a time intensive, non-specific binding prone step-and-repeat method is normally used to form the individual capture layers, we chose to pursue a combined deposition method involving sample wells and photo- activated crosslinkers. The result was a covalently linked multi-component capture layer formed in a short period of the time. Specific and cross-reactive activities of this antibody array were gauged by sequentially injecting analyte specific to one antibody area at a time. Results suggested that the binding of each analyte occurred predominately in the correct area and, depending on the particular antibody, generated varying levels of cross reactivity. A comparison of result with previously acquired, physically adsorbed capture layer data did not infer one deposition technique was better than the other.
Grating-coupled, thin-film integrated optical waveguide (IOW) structures were fabricated using standard transmission photolithography and employed in a fluoro-affinity assay for the trace detection of analyte. Using a ruled chrome-on-quartz mask with a 0.7 m repeat, gratings of three etch depths—0.6, 0.8, and 1.0 mm—were ion milled into 0.5-mm-thick quartz substrates. Silicon oxynitride (SiON) guiding films (1.5 mm) were deposited on the etched substrates by plasma-enhanced chemical vapor deposition (PECVD). Coupling efficiencies for the first diffracted grating orders into the zero-order IOW-guided modes were evaluated at 632.8 nm. The deepest gratings coupled the most light; however, their efficiency was less than half that of prisms. Binding isotherms for fluorescently labeled avidin (Cy5-Av) binding to a biotinylated bovine serum albumin (BSA) adlayer were generated from both prism- and grating-coupled SiON sensor data. Both techniques discriminated the binding of avidin from a 10215 M solution; however run-to-run (intraassay) and between-sensor (interassay) variability reduced reliability of the measurements.
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