Dr. Xin Xie Profile

Dr. Xin Xie

Assistant Professor

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Xin Xie is currently a Research Assistant, PhD candidate at Optical Lab, Oakland University, United State of America. He received Bachelor of Engineering in Precision Instrumentation Science from Hefei University of Technology in 2010 and Master of Science in Mechanical Engineering from Oakland University in 2012. His main research interests include optical metrology, phase-shift technology, digital shearography, non-destructive testing, quality inspection and material behavior testing.

From 2012 to now, he has published 22 journal/conference papers and received more than 90 citations. 2 PCT patents under his name are in processing.

SPIE Press Book | 20 April 2016

Digital Shearography: New Developments and Applications

Lianxiang Yang, Xin Xie

KEYWORDS: Shearography, Phase shifts, Nondestructive evaluation, Speckle pattern, Speckle, CCD cameras, Cameras, Phase measurement, Fringe analysis, Mirrors

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Digital Shearography: New Developments and Applications

Proceedings Article | 4 March 2015 Paper

Review of recent developments of spatial phase-shift digital shearography

Xin Xie, Xiaona Li, Xu Chen, Lianxiang Yang

Proceedings Volume 9302, 93020E (2015) https://doi.org/10.1117/12.2075536

KEYWORDS: Shearography, Fourier transforms, Speckle pattern, CCD cameras, Michelson interferometers, Beam splitters, Mach-Zehnder interferometers, Phase interferometry, Mirrors, Nondestructive evaluation

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Proceedings Article | 10 October 2013 Paper

Review and comparison of temporal- and spatial-phase shift speckle pattern interferometry for 3D deformation measurement

Xin Xie, Lianxiang Yang, Xu Chen, Nan Xu, Yonghong Wang

Proceedings Volume 8916, 89160D (2013) https://doi.org/10.1117/12.2036603

KEYWORDS: 3D metrology, Speckle pattern, Phase shifts, Interferometry, Digital holography, Speckle, Shearography, Beam splitters, Optical engineering, Optical signal processing

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High accuracy full field three dimensional (3D) deformation measurements have always been an essential problem for the manufacturing, instrument, and aerospace industry. 3D deformations, which can be translated further into 3D strain and stress, are the key parameter for design, manufacturing and quality control. Due to the fast development of the manufacturing industry, especially in the automobile and airspace industry, rapid design and optimization concepts have already widely accepted. These concepts all require the support of rapid, high sensitive and accuracy 3D deformation measurement. Advanced optical methods are gaining widely acceptance for deformation and stain measurement by industry due to the advantages of non-contact, full-field and high measurement sensitivity. Of these methods, Electronic Speckle Pattern Interferometry (ESPI) is the most sensitive and accurate method for 3D deformation measurement in micro and sub micro-level. ESPI measures deformation by evaluating the phase difference of two recorded speckle interferograms under different loading conditions. Combined with a phase shift technique, ESPI systems can measure the 3D deformation with dozens of nanometer level sensitivity. Cataloged by phase calculation methods, ESPI systems can be divided into temporal phase shift ESPI systems and spatial phase shift ESPI system. This article provides a review and a comparison of temporal and spatial phase shift speckle pattern interferometry for 3D deformation measurement. After an overview of the fundamentals of ESPI theory, temporal phase-shift and spatial phase-shift techniques, 3D deformation measurements by the temporal phase-shift ESPI which is suited well for static measurement and by the spatial phase-shift ESPI which is particularly useful for dynamic measurement will be discussed in detail. Basic theory, brief derivation and different optical layouts for the two systems will be presented. The potentials and limitations of the both ESPI systems will be demonstrated by examples of precise and simultaneous measurement of 3D deformations under either static or dynamic loadings.

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