Optical surfaces are achieving increasingly complex shapes which brings out challenges to functionalize them conformally for improved performance. Besides, plastic optics pose a great challenge on coating technologies due to their large coefficient of thermal expansion and poor adhesion of functional coatings. Here, the potential of plasma enhanced atomic layer deposition (PEALD) technique to develop uniform and 3D-conformal films on polycarbonate (PC) (Makrolon) planar and dome substrates has been explored. It enables to grow conformal Al2O3, TiO2 and SiO2 films on steeply curved PC substrates. Moreover, we demonstrate an 11-layer antireflection (AR) coating reaching about 0.2% reflection at 905 nm wavelength on the entire outer surface of several PC domes along with a consistent optical performance on the inner surface. The adhesion and environmental stability tests according to ISO-9211-04 resulted in promising adhesive and environmentally durable films on PC dome optics. These results suggest a possible way to grow uniform, dense, conformal, and stable optical coatings on sensitive polymer PC substrates for desired optical applications.
Complex interference multilayer systems typically implemented in high-performance optics consists of several layers of low and high refractive index materials. Low mechanical stress of the coatings is desired to avoid cracking and delamination of the film or a deformation of the substrate. It is known that the ion energies in plasma-assisted deposition can be employed to control material properties and thereby mechanical stress. In this study, we evaluate the influence of substrate biasing on mechanical stress and optical properties of alumina (Al2O3) coatings deposited by plasma enhanced atomic layer deposition (PEALD). Substrate biasing up to -300 V was applied during O2 plasma exposure in the second step of a two-step PEALD process. To distinguish the physical effect of ion bombardment from the physico-chemical effect, a substrate bias of -100 V was applied separately and only during Ar plasma exposure that constituted the third step of a three-step PEALD process. Al2O3 films were characterized using spectroscopic ellipsometry, spectrophotometry, xray photoelectron spectroscopy (XPS), x-ray diffractometry (XRD), x-ray reflectometry (XRR), Fourier transform infrared spectroscopy (FT-IR), wafer-curvature measurement and atomic force microscopy (AFM).
Conference Committee Involvement (3)
Nanoscale Excitations in Emergent Materials (NEEM 2013)
22 November 2013 |
14th International conference Indian Academy of Physical Sciences’2011
22 December 2011 |
76th Annual Conference of the Indian Mathematical Society (IMS 2010)
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