Low temperature curing of Ag paste for electrode formation in silicon hetero junction (SHJ) solar cells is important for providing better device characteristics. Ag paste is composed of solvent, various organic materials, and additives; hence its electrical and mechanical adhesion properties depend on the curing conditions. The adhesion of the Ag paste was determined by scratch test, whereas the specific contact resistance was measured using the transfer length method. Various Ag electrodes were formed at various curing temperatures within the temperature range of 160°C–240°C, at 20°C intervals. The curing time was also varied for another set of Ag electrodes. With 200°C temperature and for 20-min curing, the critical load of 20.06 N and specific contact resistance of were observed. Using the same conditions, the efficiency of the SHJ solar cell was found to be improved by 3.8%.