Preparation of light-emitting devices with poly(p-phenylenevinylene): effects of thermal elimination conditions and polymer layer thickness on device performance

Chang Seoul; Jai Ick Kang; Souk Il Mah; Changhee Lee

doi:10.1117/12.305419

17 April 1998 Preparation of light-emitting devices with poly(p-phenylenevinylene): effects of thermal elimination conditions and polymer layer thickness on device performance

Chang Seoul, Jai Ick Kang, Souk Il Mah, Changhee Lee

Author Affiliations +

Proceedings Volume 3281, Polymer Photonic Devices; (1998) https://doi.org/10.1117/12.305419
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

The thermal elimination conditions for more efficient poly(p- phenylene vinylene) polymer light-emitting diodes were established: the precursor films must be heated to 230 degrees Celsius and kept at that temperature for 5 min. under a N₂ flow of 50 ml/min. By the heat treatment the degree of conversion to PPV was about 70%. The external quantum efficiency of 0.0078% was achieved for the ITO/70% PPV/Al devices. The brightness of the device was calculated from the efficiency to be 2.3 cd/m² at 200 MV/m (current density of 0.2 mA/mm²).

Citation Download Citation

Chang Seoul, Jai Ick Kang, Souk Il Mah, and Changhee Lee "Preparation of light-emitting devices with poly(p-phenylenevinylene): effects of thermal elimination conditions and polymer layer thickness on device performance", Proc. SPIE 3281, Polymer Photonic Devices, (17 April 1998); https://doi.org/10.1117/12.305419

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