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24 April 2020 A study of failure criteria for a crack in multilayer ceramic capacitors by ball drop test (Conference Presentation)
Soo-Hyun Eom, Jung-Ryul Lee, Dae Sung Son, Chun Myung Park, Jae Hoon Lim, Seong Jin Kim, Chang Kyu Park
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Proceedings Volume 11376, Active and Passive Smart Structures and Integrated Systems XIV; 113760W (2020) https://doi.org/10.1117/12.2558351
Event: SPIE Smart Structures + Nondestructive Evaluation, 2020, Online Only
Abstract
Measuring with strain gages has a limitation of consuming time to prepare for the experiment and attaching near the MLCCs, making it does not represent the physical quantities of the MLCCs itself. In this study, we propose a ‘failure criteria for a crack in MLCCs soldered on a Print-Circuit-Board by ball drop test’ based on the acceleration measured by Laser Doppler Vibrometers. By drawing a Shock Response Spectrum, we can find the dominant frequency for the failure of MLCCs. In addition, we present a suitable deformation form of the Print-Circuit-Board by using a high-speed camera.
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Soo-Hyun Eom, Jung-Ryul Lee, Dae Sung Son, Chun Myung Park, Jae Hoon Lim, Seong Jin Kim, and Chang Kyu Park "A study of failure criteria for a crack in multilayer ceramic capacitors by ball drop test (Conference Presentation)", Proc. SPIE 11376, Active and Passive Smart Structures and Integrated Systems XIV, 113760W (24 April 2020); https://doi.org/10.1117/12.2558351
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KEYWORDS
Ceramics
Capacitors
Velocity measurements
Failure analysis
Laser Doppler velocimetry
Sensors
Dielectrics
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