New mechanism of ultra-deep drilling of solids by high-power lasers

Sergey I. Kudryashov; Andrew V. Pakhomov; Susan D. Allen

doi:10.1117/12.589234

12 April 2005 New mechanism of ultra-deep drilling of solids by high-power lasers

Sergey I. Kudryashov, Andrew V. Pakhomov, Susan D. Allen

Author Affiliations +

Proceedings Volume 5713, Photon Processing in Microelectronics and Photonics IV; (2005) https://doi.org/10.1117/12.589234
Event: Lasers and Applications in Science and Engineering, 2005, San Jose, California, United States

Abstract

A new mechanism of ultra-deep drilling and related molten material expulsion during high-power short-pulse laser ablation of metals, semiconductors and dielectrics is proposed. In this mechanism ultra-deep (multi-micron) heat penetration and melting depths in these materials are assumed to result from their bulk absorption of thermal short-wavelength con-tinuous and characteristic radiation emitted by hot near-surface ablative laser plasmas. Multi-microsecond delays for expulsion of subsonic jets of micron-size droplets and for re-radiation of UV bursts from the irradiated targets are ex-plained by subsurface explosive boiling in bulk of the resulting ultra-deep melt pool.

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Sergey I. Kudryashov, Andrew V. Pakhomov, and Susan D. Allen "New mechanism of ultra-deep drilling of solids by high-power lasers", Proc. SPIE 5713, Photon Processing in Microelectronics and Photonics IV, (12 April 2005); https://doi.org/10.1117/12.589234

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