In this paper, we demonstrate photosensitive polyimide (PSPI) profile optimization to effectively reduce stress concentrations and enable PSPI as protection package-induced stress. Through detailed package simulation, we demonstrate ~45% reduction in stress as the sidewall angle (SWA) of PSPI is increased from 45 to 80 degrees in Cu pillar package types. Through modulation of coating and develop multi-step baking temperature and time, as well as dose energy and post litho surface treatments, we demonstrate a method for reliably obtaining PSPI sidewall angle >75 degree. Additionally, we experimentally validate the simulation findings that PSPI sidewall angle impacts chip package interaction (CPI). Finally, we conclude this paper with PSPI material and tool qualification requirements for future technology node based on current challenges.
This article presents design and development of a novel 3D micromirror for large deflection scanning application in invivo
optical coherence tomography (OCT) bio-imaging probe. Overall mirror chip size is critical to reduce the diameter of the probe; however, mirror plate itself should not be less than 500 μm as smaller size means reducing the amount of light collected after scattering for OCT imaging. In this study, mirror chip sizes of 1 × 1 mm2 and 1.5 × 1.5 mm2 were developed with respectively 400 and 500 micrometer diameter mirror plates. The design includes electro thermal excitation mechanism in the same plane as mirror plate to achieve 3D free space scanning. Larger deflection requires longer actuators, which usually increase the overall size of the chip. To accommodate longer actuators and keep overall chip size same curved beam actuators are designed and integrated for micromirror scanning. Typical length of the actuators was 800 micrometer, which provided up to 17 degrees deflection. Deep reactive ion etching (DRIE) process
module was used extensively to etch high aspect ratio structures and keep the total mirror chip size small.
Micro fluidic package with integrated reservoirs has been developed for DNA /RNA extraction application. A
membrane based pump which consists of a reservoir to store reagents and a pin valve to control the fluid is developed
to dispense the reagents into the chip. A programmable external actuator is fabricated to dispense the fluid from the
membrane pump into the DNA chip. An elastic and high elongation thin rubber membrane is used to seal the
membrane pump and at the same time prevent actuator from mixing with different reagents in the micro fluidic
package. Break displacement during actuation of membrane pump sealing material is studied with different ratios of
PDMS and other types of rubber materials. The fluid flow from the reservoir to the chip is controlled by a pin valve
which is activated during the external actuation. A CFD simulation is performed to study the pumping action dusting
the external actuation and is validated with experimental results.
A biocompatible housing for an optical bio-probe is developed for OCT (Optical Coherence Tomography)
imaging application. Silicon micro machined 3D mirror is used to steer the optical beam in to the sample
of interest. A Grin lens fiber assembly is used to couple the light from the light source to the micro mirror.
A Silicon Optical bench (SiOB) is used to integrate the optical components and the 3D mirror. The
integrated assembly is housed in a poly carbonate housing with AR (anti reflection) coating on the inner
and outer sides of the housing wall. Micro injection molding method is used t o fabricate a miniaturized
probe housing which is transparent to 1300nm. Miniaturized housing is tested in an OCT setup and the
captured image is processed.
In this paper, we present a non-rotatory circumferential scanning optical probe integrated with a MEMS scanner for in
vivo endoscopic optical coherence tomography (OCT). OCT is an emerging optical imaging technique that allows high
resolution cross-sectional imaging of tissue microstructure. To extend its usage to endoscopic applications, a
miniaturized optical probe based on Microelectromechanical Systems (MEMS) fabrication techniques is currently
desired. A 3D electrothermally actuated micromirror realized using micromachining single crystal silicon (SCS) process
highlights its very large angular deflection, about 45 degree, with low driving voltage for safety consideration. The
micromirror is integrated with a GRIN lens into a waterproof package which is compatible with requirements for
minimally invasive endoscopic procedures. To implement circumferential scanning substantially for diagnosis on certain
pathological conditions, such as Barret's esophagus, the micromirror is mounted on 90 degree to optical axis of GRIN
lens. 4 Bimorph actuators that are connected to the mirror on one end via supporting beams and springs are selected in
this micromirror design. When actuators of the micromirror are driven by 4 channels of sinusoidal waveforms with 90
degree phase differences, beam focused by a GRIN is redirected out of the endoscope by 45 degree tilting mirror plate
and achieve circumferential scanning pattern. This novel driving method making full use of very large angular deflection
capability of our micromirror is totally different from previously developed or developing micromotor-like rotatory
MEMS device for circumferential scanning.
Design and development of a 3D scanning MEMS micromirror integrated miniaturized optical probe has been presented
in this article. The probe is designed to be less than 2 mm in diameter and has dynamic scanning modality for larger field
of view. Scanning is achieved using 3D micromirror device, which has 16º out of plane and 360º beam rotation
capability. Initial target of 45º out of plane deflection is yet to be achieved. The probe being developed currently would
have scanning capability in one quarter of 360º full rotation. The field of view would still be very large and multiple
optical biopsies would be possible for planned cancer model diagnostics. The feasibility of using scanning mirror into an
optical probe was demonstrated using scanning repeatability and OCT imaging tests. Geometrical optics and package
design using silicon optical bench have been established. Miniaturized 3D scanning micromirror have been designed and
developed with 16º out of plane deflection demonstrated. Probe package integration and optical testing are carried out.
A Si based capacitive microrelay has been packaged in a premolded package and the packaging issues has been studied and verified by FEA and experimental methods. A quasi-3D finite element modeling has been used to understand the thin cap warpage on the microrelay under different process conditions. Experimental verification on the cap warpage showed that thermal loading is not the only contributing parameter for the cap warpage. A modified model with air loading effect and thermal loading effect validated the experimental result. Solution to overcome this problem has been studied with a hole in the package and reinforcement of cap with epoxy.
In this paper two different packaging and testing approaches were studied for Si based microphone. Microphone performance was tested with Ceramic, Plastic and metal packages. Sensitivity testing of microphone is done when it is connected to an ASIC die. Testing was done with microphone and ASIC packaged separately and also in a single package. Substantial noise was generated when microphone and ASIC are tested separately in a PCB. Noise was detected after 150 Hz with the noise intensity reducing as it goes to higher frequencies. This was observed regardless of the packaging schemes. Different shielding methods were tried and found that copper foil shielding results in substantial noise reduction during frequency response testing and a flat response curve was observed with metal can package. Form this new testing methodology, it is demonstrated that same ASIC can be used repeatedly during microphone testing and hence some cost reduction can be expected.
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