The dielectric loss characteristics of epoxy resin, as a critical insulating material in high-frequency transformers, are essential to the performance and safety of the transformers. This paper explores the dielectric loss mechanism of epoxy/anhydride curing systems through molecular dynamics simulations, particularly focusing on the impact of segmental motion characteristics on dielectric loss. The study reveals that the probability density distribution of the motion speeds of various segments in the epoxy/anhydride cross-linked network follows the Maxwell-Boltzmann distribution. The increased rigidity of the curing agent structure reduces the displacement capability of anhydride and ester bond segments but provides greater motion space for epoxy segments, reducing motion resistance. Additionally, the methyl side chains in the anhydride further promote the motion of epoxy segments by providing additional displacement and support. These discoveries offer crucial insights for optimizing epoxy resin design, significantly contributing to the performance enhancement of highfrequency transformers in smart grids.
In order to obtain insulation characteristic parameters corresponding to casing defects, the causes of defects were analyzed, and defects were simulated in actual casing, including poor drying of insulating paper inside casing, microcracks in core caused by thermal stress concentration during core solidification, and bubbles generated in core due to poor material degassing. The characteristics of partial discharge dielectric loss factor tanδ and capacitance number during the early insulation defect development of epoxy adhesive paper casing were studied by comparative measurement. The results show that the tanδ value and capacitance value of defective casing increase with aging time. The research results can provide reference for casing factory test and on-site insulation diagnosis.
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