For upcoming EUV high volume manufacturing, the EUV mask infrastructure plays a central role for its successful introduction. One of the key items in the EUV mask infrastructure is the need of manufacturing defect free photomasks for which an actinic mask review capability is a critical success factor. ZEISS and the SUNY POLY SEMATECH EUVL Mask Infrastructure consortium have developed and commercialized the EUV aerial image metrology system, the AIMS™ EUV. In this paper we present the latest achievements of this AIMS™ EUV platform together with data and analysis of LER/LWR measurements in the aerial image. We provide an overall project overview and discuss possible future extensions options based on this actinic metrology platform.
Actinic review of potential defect sites and verification of their repair is a key step in producing defect free masks. The
AIMSTM systems are the industry proven standard for this task and the AIMSTM EUV has been developed to provide this
functionality for EUV masks. Thereby it closes an important gap in the EUV mask infrastructure for volume production.
In this paper, we show the readiness of the AIMSTM EUV for defect review and verification, and discuss the use of actinic
aerial image metrology beyond this core application. In particular, we show measurements on mask 3D effects and the
contribution of photon stochastics on wafer local CDU.
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