We report on a 4x4 optical matrix switch for telecom application. It consists of a 4x4 array of vertical mirrors that have the same pitch as the fibers of commercially available fiber ribbons (250 μm). This compact design enables a parallel assembly to optical components, which simplifies the time consuming and costly process for switches with larger pitch. Additionally, a small pitch leads to a short optical coupling length, which facilitates the integration of a suitable collimation system. However there are physical limitations for optical MEMS in conjunction with assembled micro-optics. The optical beam exiting a collimator diverges, the divergence angle is indirectly proportional to the beam waist and the coupling length increases quadratically. Our calculations show that for a pitch of 250 µm a mirror height of 100 μm is optimal. The mirrors are monolithically etched onto a platform etched during a previous step. No assembly of the mirrors to the actuators is needed. Alignment structures for the optical components are etched during the same step as the mirrors, which lead to self aligned structures. The platform is supported by 150 μm long torsion beams with sub-micron diameter. The electrostatic actuation voltage is given by a separate chip. The mirror moves out of the optical path when the platform is actuated and goes to the switching state if no voltage is applied. The first prototypes have been actuated at 200 V, which agrees with a CoventorWare simulation used for designing the device. Light was successfully switched with a 4x4 OXC. An 8x8 OXC is shown and electrostatically characterized.
We present the design and characterization of a new 4 X 4 switch based on the previously developed 2 X 2 fiber switch. The switching principle uses plasma etched vertical mirrors that can be moved in and out of two pairs of optical fibers with the integrated electrostatic actuator. The 4 X 4 switch is built by connecting 16 individual 2 X 2 switches in a common package (100 X 50 X 35 mm). Instead of integrating the 16 switch elements on the same chip, we preferred assembling the switches by fusion splicing. The insertion loss is less than 1.8 dB for each state.
We present a miniaturized Fourier transform (FT) spectrometer based on silicon micromachined. The FTS is a Michelson interferometer with one scanning mirror. The motion of the mirror is carried out by a n electrostatic comb drive actuator. The mirror displacement is 39 micrometers and its reproducibility is +/- 13 nm, which leads to a resolution better than 10 nm in the visible wavelength range. A new design of this chip has been realized in order to integrate an input fiber, a collimating lens system as well as a beam splitting plate. This new design allows to undertake spectroscopy with white light. The limitation of light collimation and the effect of the size of the source have been studied by numerical simulations.
The continuous progress in micro- and nano-system technologies has allowed the successful development of many innovative products in process control, environmental monitoring, healthcare, automotive and aerospace as well as information processing systems. In this paper on overview will be given of current progress in micro- and nanofabrication process technologies, such as deep reactive ion etching, micro-electro discharge machining, thick photoresistant processing and plating. The availibility of these micro- and nanofabrication processes will be illustrated with examples of new generations of silicon-based sensors, actuators and Microsystems with a particular emphasis on real applications of these components and systems.
KEYWORDS: Silicon, Actuators, Sensors, Field effect transistors, Gas sensors, Microfabrication, Atomic force microscopy, Deep reactive ion etching, Switches, Microsystems
The continuous progress in micro- and nano-system technologies has allowed the successful development of many innovative products in process control, environmental monitoring, healthcare, automotive and aerospace as well as information processing systems. In this paper on overview will be given of current progress in micro- and nanofabrication process technologies, such as deep reactive ion etching, micro-electro discharge machining, thick photoresistant processing and plating. The availibility of these micro- and nanofabrication processes will be illustrated with examples of new generations of silicon-based sensors, actuators and Microsystems with a particular emphasis on real applications of these components and systems.
The continuous progress in micro- and nano-system technologies has allowed the successful development of many innovative products in process control, environmental monitoring, healthcare, automotive and aerospace as well as information processing systems. In this paper on overview will be given of current progress in micro- and nanofabrication process technologies, such as deep reactive ion etching, micro-electro discharge machining, thick photoresistant processing and plating. The availibility of these micro- and nanofabrication processes will be illustrated with examples of new generations of silicon-based sensors, actuators and Microsystems with a particular emphasis on real applications of these components and systems.
The continuous progress in micro- and nano-system technologies has allowed the successful development of many innovative products in process control, environmental monitoring, healthcare, automotive and aerospace as well as information processing systems. In this paper on overview will be given of current progress in micro- and nanofabrication process technologies, such as deep reactive ion etching, micro-electro discharge machining, thick photoresistant processing and plating. The availibility of these micro- and nanofabrication processes will be illustrated with examples of new generations of silicon-based sensors, actuators and Microsystems with a particular emphasis on real applications of these components and systems.
KEYWORDS: Silicon, Actuators, Sensors, Field effect transistors, Gas sensors, Microfabrication, Deep reactive ion etching, Semiconducting wafers, Atomic force microscopy, Switches
The continuous progress in micro- and nano-system technologies has allowed the successful development of many innovative products in process control, environmental monitoring, healthcare, automotive and aerospace as well as information processing systems. In this paper on overview will be given of current progress in micro- and nanofabrication process technologies, such as deep reactive ion etching, micro-electro discharge machining, thick photoresistant processing and plating. The availibility of these micro- and nanofabrication processes will be illustrated with examples of new generations of silicon-based sensors, actuators and Microsystems with a particular emphasis on real applications of these components and systems.
KEYWORDS: Silicon, Actuators, Sensors, Field effect transistors, Gas sensors, Microfabrication, Deep reactive ion etching, Semiconducting wafers, Atomic force microscopy, Microsystems
The continuous progress in micro- and nano-system technologies has allowed the successful development of many innovative products in process control, environmental monitoring, healthcare, automotive and aerospace as well as information processing systems. In this paper on overview will be given of current progress in micro- and nanofabrication process technologies, such as deep reactive ion etching, micro-electro discharge machining, thick photoresistant processing and plating. The availibility of these micro- and nanofabrication processes will be illustrated with examples of new generations of silicon-based sensors, actuators and Microsystems with a particular emphasis on real applications of these components and systems.
Optical MEMS is a challenging new field that combines micro- optics with micro-mechanics in order to build compact systems. In this paper we present a miniaturized Fourier transform spectrometer (FTS) fabricated on silicon. The FTS is a Michelson interferometer with one scanning mirror. The motion of the mirror is carried out by a new type of electrostatic comb drive actuator. The mirror is designed to be linear with respect to the applied voltage. Experimentally, we have measured a mirror displacement of 38.5 micrometer corresponding to a maximum optical path difference of 77 micrometer. The applied voltage was plus or minus 10 V and the non-linearity of the driving system is plus or minus 0.25 micrometer. A method is presented to correct the spectrum in order to get rid of the non-linearity. The measured resolution of the spectrometer after the phase correction is 16 nm at a wavelength of 633 nm.
In this paper we present a miniaturized Fourier Transform spectrometer based on a Michelson interferometer with a scanning mirror. The motion of the mirror is carried out by a new type of electrostatic comb drive actuator. The displacement of the mirror is linear with the applied voltage. Experimental results are presented.
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