The commercially available Synova Laser MicroJet® technology combines conventional laser capabilities with compressed water jet that precisely guide laser beam in a similar manner to optical fibers. Due to physical water breakdown, technology is typically focused on the nanosecond pulse duration range. A stable beam shaping setup with a diffusor and commercial fiber to couple into water jet, was developed allowing to test Laser MicroJet® at 100-300 ps pulse duration. The change to energy intensity profile with diffuser allowed to triple coupled energy without inducing the physical breakdown in water and could be further increased by implementing 2 and 3 pulse bursts into the setup. High quality scribing was achieved at Si wafer at high scanning speed. Preliminary results on multilayer Si-wafer have demonstrated that scribing quality is in this case more feedrate dependent, limited chipping occurring at speed of commercial interest. Cutting tests were performed on semiconductors as well as on metals. On both, it was possible to achieve high quality cuts with high feedrate up to 12 mm/s with Ra < 0,3 μm.
The Laser Micro-Jet® is now a well-established technique for micro-machining and high-quality machining of hard materials. The advantages of the water-jet guided laser ablation are narrow parallel cut walls without focus adaptation, minimizing the heat-affected zone by the water cooling and the avoidance of burrs due to constant water flow.
To further enhance this innovative technology towards industry 4.0, automation and sensing packages have been implemented into the CNC platforms. Ease of use measures include self-calibration by an automatic adjustment of the water jet angle and an automatic alignment of the laser beam into the waterjet nozzle, guaranteeing precision.
The process has become self-correcting by adding a break-through sensor, which detects the end of cutting or drilling by a change in the processing light when the laser fully traverses the material. The suppression of unnecessary extra passes leads to a diminution in overall processing time, in some cases up to 20 %, additionally the cutting defect rate drops below 1%.
The integration of an automatic jet laminarity sensor adds the ability to detect waterjet degradation over time and is the first step towards machine self-check. Finally, Synova is developing automatic 3D-machining with depth sensing capabilities for a controlled and feed-backed ablation of 3D-profiles. An intelligent choice of toolpath, adapted to the LMJ-technology, will further advance feedforward machining capabilities.
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