Mr. Huang Yu-Kuang Profile

Huang Yu-Kuang

at Photronics DNP Mask Corp

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Author

Publications (5)

Proceedings Article | 26 August 2024 Paper

A study of CrOx composed progressive defect on attenuated PSM and its damaged-free removal process

Joyce Wang, Josh Cheng, Ewin Zhuo, Kevin Yu, Ansel Huang, Mazer Li, Kuang Huang, Zack Huang

Proceedings Volume 13177, 131770J (2024) https://doi.org/10.1117/12.3032717

KEYWORDS: Chromium, Plasma, Mask cleaning, Etching, Plasma treatment

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Proceedings Article | 26 August 2024 Paper

A study on directional damaged defect in photomask manufacturing process

Ansel Huang, Joyce Wang, Mazer Li, Vies Yu, Josh Cheng, Kuang Huang, Zack Huang

Proceedings Volume 13177, 131770K (2024) https://doi.org/10.1117/12.3032447

KEYWORDS: Scanning electron microscopy, Inspection, Etching, Chromium, Photomasks, Mask cleaning, Critical dimension metrology, Manufacturing, Electrical conductivity, Photomask technology

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Proceedings Article | 29 September 2023 Paper

MoSi stain defect reduction in photo resist strip process

Ewin Zhuo, Ansel Huang, Zain Zhang, Joyce Wang, Mazer Li, Josh Cheng, Kuang Huang, Zack Huang

Proceedings Volume 12915, 129150F (2023) https://doi.org/10.1117/12.2684159

KEYWORDS: Etching, Chromium, Plasma etching, Photoresist processing, Mask cleaning, Liquids

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Proceedings Article | 16 September 2022 Paper

Massive tiny MoSi defect reduction in NCAR photoresist blank

Joyce Wang, Ansel Huang, Mazer Li, Josh Cheng, Bin Lin, Ewin Zhuo, Gerrard Chen, Kevin Yu, Yu-Kuang Huang, Zack Huang

Proceedings Volume 12325, 123250C (2022) https://doi.org/10.1117/12.2640450

KEYWORDS: Etching, Inspection, Photoresist materials, Photomasks, Photoresist developing, Plasma, Manufacturing, Reactive ion etching, Plasma etching, Photoresist processing

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Proceedings Article | 13 July 2017 Paper

Stabilize OMOG photomask post-repair CD variation by cleaning strategy and post-repair treatment

Vincent Shen, Josh Tzeng, Kuang Huang, Vic Chang

Proceedings Volume 10454, 104540U (2017) https://doi.org/10.1117/12.2277685

KEYWORDS: Semiconducting wafers, 3D modeling, Etching, Opacity, Electromagnetism, Photomasks, Nitrogen

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