A phase change memory cell based on Ge0.5Sb2Te3/Ti0.6Sb2Te3 double-layer structure is proposed for 3-level storage. The fabricated cell can realize 3-level storage ability by both current and voltage operation. Cycling ability has been proved better than 2×103. Thermal simulation shows that the resistivity difference between the two materials can greatly affect the temperature distribution in the cell. More heat will be generated in the amorphous Ge Ge0.5Sb2Te3/ film when the current flow through due to the higher resistivity. And the lower crystallization temperature of Ge0.5Sb2Te3/compared to that of Ti0.6Sb2Te3 ensures its priority of crystallization, which makes the 3-level storage feasible.
A novel phase change material, Si2Sb2Te3 has been reported to show good phase change abilities. Etching of this material is a critical step in the fabrication of phase change memory devices. In this paper, the characteristics of Si2Sb2Te3 etched in CF4/Ar atmosphere are investigated. The influence of the etching rate and surface roughness with different CF4/Ar ratio, pressure, and power are systematically studied. Furthermore, our X-ray photoelectron spectroscopy test results show that Te is the bottleneck to accelerating the etching rate.
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.