Wafer defects are caused by defects on the surface of the Wafer grinding jig. Therefore, this research is aimed at optical inspection of the self-made dataset of the Wafer grinding jig by using the UNet++ network model. Because of the different background distribution of the inner and outer edges in Wafer grinding jig, it is difficult to detect defects solely by Deep learning. Hence, this study uses Image processing to separate the inner and outer edge and then uses UNet++ with transfer learning to detect the location of the defects. In addition, false detection is reduced by tracking the defects as the jig moves regularly. The proposed deep network layer reduction method can decrease the detection time to 48.27% compared to the original network model. The recall rate and IoU of the outer edge are increased by 13.8% and 16.33% through transfer learning. The recall rate and IoU of the inner edge are increased by 2.01% and 1.16% respectively through transfer learning. And the final defect tracking recall rate reached over 75.81%, while the F1 score reached over 77.08% in every frame from 112 to 192 frames.
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